Design and Thermal Analysis of Heat Sink for Light Emitting Diode of Street Light
DOI:
https://doi.org/10.24113/ijoscience.v4i1.121Abstract
Light-Emitting Diode (LED) street lamps swear heavily on prospering thermal management, that powerfully affects the optical extraction and also the reliability/durability of the LED lamp. Light Emitting Diode (LEDs) are currently wide employed in several fields together with traffic lights, vehicle backlights and liquid show (LCD) displays thanks to their long life, sensible illumination potency and low energy consumption. At present, LEDs are more and more commutation the standard lighting and are getting used normally illumination cherish the road lamp. For the dynamic LED street lamps, sensible light-weight extraction is that the most vital factor, however low junction temperature of the LED modules is additionally vital for achieving an extended period of time and a high optical potency. Actually, there are several reports concerning early failures of street lamps, known as dead lamps that are thought to be a barrier within the public and administration acceptance of LED street lamps. Thus temperature estimation is often a vital issue for LED development. During this paper we have a tendency to review completely different previous work of thermal analysis on LED and conjointly discuss concerning drawbacks and deserves of previous analysis.
Downloads
References
Alan, M.: ‘Solid state lighting—a world of expanding opportunities at LED 2002’, III–V Rev., 2003, 16, (1), pp. 30–33
Alan, M.: ‘Lighting: the progress & promise of LEDs’, III–V Rev., 2004, 17, (4), pp. 39–41
Narendran, N., and Gu, Y.M.: ‘Life of LED-based white light sources’, IEEE J. Disp. Technol., 2005, 1, (1), pp. 167–171
Wilcoxon, R., and Cornelius, D.: ‘Thermal management of an LED light engine for airborne applications’. Proc. 22nd IEEE Semiconductor Thermal Measurement and Management Symp., Dallas, TX, USA, March 2006, pp. 178–185
Kim, S.K., Kim, S.Y., and Choi, Y.D.: ‘Thermal performance of cooling system for red, green and blue LED light source for rear projection TV’. Proc. Tenth Intersociety Conf. Thermal and Thermo mechanical Phenomena in Electronics Systems, San Diego, CA, USA, May 2006, pp. 377–379
Liu, S., Lin, T., Luo, X.B., Chen, M.X., and Jiang, X.P.: ‘A microjet array cooling system for thermal management of active radars and high-brightness LEDs’. Proc. Fifty-Sixth Electronic Components and Technology Conf., San Diego, CA, USA, May 2006,pp. 1634–1638
Luo, X.B., Chen, W., Sun, R.X., and Liu, S.: ‘Experimental and numerical investigation of a microjet based cooling system for high-power LEDs’, Heat Transf. Eng., in press
Luo, X.B., and Liu, S.: ‘A microjet array cooling system for thermal management of high-brightness LEDs’, IEEE J. Adv. Packag., in press
Petroski, J.: ‘Understanding longitudinal fin heat sink orientation sensitivity for light emitting diode (LED) lighting applications’. Proc. Int. Electronic Packaging Technical Conf. Exhibition, Maui, Hawaii, USA, July 2003, pp. 111–117
Chen, J.H., Liu, C.K., Chao, Y.L., and Tain, R.M.: ‘Cooling performance of silicon-based thermoelectric device on high power LED’. Proc. 24th Int. Conf. Thermoelectric, Clemson, South Carolina, USA, June 2005, pp. 53–56
Acikalin, T., Garimella, S.V., Petroski, J., and Arvind, R.: ‘Optimal design of miniature piezoelectric fans for cooling light emitting diodes’. Proc. Ninth Intersociety Conf. Thermal and Thermo mechanical Phenomena in Electronic Systems, Las Vegas, Nevada, USA, June 2004, pp. 663–671
X. Luo, T. Cheng, W. Xiong, Z. Gan and S. Liu, “Thermal analysis of an 80 W Light-Emitting Diode street lamp”, IET Optoelectron., 2007, 1, (5), pp. 191–196
Shung-Wen Kang, Kun-Cheng Chien and Wei-Chung Lin, “Multiple-Layer Heat Dissipation Module for LED Streetlamps”, Journal of Applied Science and Engineering, Vol. 15, No. 2, pp. 97_104 (2012)
Lai, C. M., Chiang, C. M. and Ho, C. J., “Thermal Performance of an Indoor Oblong LED Lighting Prototype Incorporating Heat Pipes,” Journal of Asian Architecture and Building Engineering, Vol. 8, pp. 585_592 (2009).
KIM L., SHIN M.W.: ‘Thermal analysis and design of high power LED packages and systems’. Proc. SPIE Sixth Int. Conf. Solid State Lighting, 2006, Vol. 6337, pp. 63370U-1–63370U-9
LALL B.S., GUENIN B.M., MOLNAR R.J.: ‘Methodology for thermal evaluation of multichip modules’. Eleventh IEEE SEMI-Thermal Symp., 1995, pp. 72–79
IM Y., KWON H., KIM S., KIM T., CHO T., OH S.: ‘Methodology for accurate junction temperature estimation of SIP (system in package)’. 20th Annual IEEE Semiconductor Thermal Measurement and Management Symp., 2004, pp. 117–121
ZAHN B.A.: ‘Steady state thermal characterization and junction temperature estimation of multichip module packages using the response surface method’. Sixth Intersociety Conf. Thermal and Thermo mechanical Phenomena in Electronic Systems, Seattle, WA, May 1998, pp. 39–46
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2018 Ranjeet Singh Thakur, Ashish Muchrikar

This work is licensed under a Creative Commons Attribution 4.0 International License.
IJOSCIENCE follows an Open Journal Access policy. Authors retain the copyright of the original work and grant the rights of publication to the publisher with the work simultaneously licensed under a Creative Commons CC BY License that allows others to distribute, remix, adapt, and build upon your work, even commercially, as long as they credit you for the original creation. Authors are permitted to post their work in institutional repositories, social media or other platforms.
Under the following terms:
-
Attribution — You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
- No additional restrictions — You may not apply legal terms or technological measures that legally restrict others from doing anything the license permits.